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PYROID® HT Pyrolytic Graphite Heat Spreaders and Thermal Vias PYROID® HT pyrolytic graphite thermal spreaders and thermal vias are a powerful new material solution in the battle against thermal heat in state-of-the-art electronic circuits and devices.

PYROID® HT pyrolytic graphite thermal spreaders and vias provides engineers high purity (>99.999%) and lightweight (2.25 g/cc) spreader options with exceptional thermal performance.

PYROID® HT matches the thermal performance of CVD diamond at 1700 W/mK and substantially better economics. Available in sheet form up to 30 cm2 and any thickness ranging from 0.25 mm to 1.3 mm, this material is ideal for high-volume production and provides economic value at the device assembly level.


See Pyroid HT Heat Spreading Ability In Action Compare it to Aluminum and Copper


Thermal Conduction Comparison

GREATER THAN 4 X COPPER AND NATURAL GRAPHITE

GREATER THAN 5 X AIN AND BeO SPEADER MATERIAL

This exciting new material offers high tensile strength and a significant increase (90 times) the flexural modulus of existing natural graphite spreader materials.

And we can engineer the Coefficient of Thermal Expansion (CTE) planes to carefully match the substrate and solder conditions to maintain the joint integrity.

Benefits of PYROID® HT Pyrolytic Graphite:

  • Higher strength than alternative graphitic materials
  • High thermal conduction
  • Exceptionally consistent quality and performance
Find out more about how our material performs by downloading this technical presentation.

Resulting in:

  • Significant thermal spreading
  • Increased component reliability
  • Significant weight savings
  • Lowered component and system costs

Ideal for two and three dimensional thermal spreader applications like high-heat flux semiconductor power electronics, such as RF and wireless, LEDs, laser diodes, wide gap semiconductors, direct die attachment, and integrated circuit lids, to name a few.

What about hot spots?

For hot-spot issues, our HT standard spreader material offers maximum normal component of thermal conductivity at a cost effective solution without the need for special vias.

 

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