As state of the art integrated circuits (ICs) and other devices soar well into the GHz frequency range, heat dissipation is a persistent and powerful concern. Excessive heat in semiconductor device junctions shortens their lives and limits performance. Heat is also generated at imperfect metallic pins, socket and bump interconnect interfaces. Excess power affects system costs through more expensive packaging requirements. Accordingly, many experts are saying that the industry must "fundamentally rethink IC thermal management" and look at alternative approaches.
Heat density (W/cm2) is the problem and it must be moved or removed. IC temperature management has evolved into a major issue and is near the top of the industry's technical concerns.
PYROID® pyrolytic graphite provides IC thermal management solution from composite lids to thermal heat sinks. The material offers a very light weight, >99.999 percent pure, solid crystal composition, with no granular components and with superior EMI performance. The material is extremely anisotropic, meaning it conducts heat and electricity in the x-y plane like copper but acts like a ceramic in the normal direction.
Here our annealed Pyroid® HT material version has thermal and conduction properties increasing up to four to eight times that of copper and aluminum, respectively (thermal conductivity as high as 1700 W/m°K). We are able to selectively bond the planes through special fixturing to take maximum advantage of its directional conductivity creating high conducting, near isotopic, economical, heat spreaders as thick as 1.3 mm.
Our material is finding multiple uses in a variety of industries including aerospace, defense, military, electronic, medical device, and power generation.
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